BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9 60803M • 【Premium Materials】 Crafted from
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9 60803M • 【Premium Materials】 Crafted fromFeatures & Specifications Made by high quality metal material Easy and quickly for reballing the BGA IC Excellent to replace IC or BGA rework reballing Compatible with Universal Models Universal Package included 1 x BST iPH 2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S 6SP A9
Pay in 4 interest-free payments of $4.80 Learn more
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 11 - Aug 16