BIONIKA DI UF, Temporary abutment, implant level, positioned Diameter:Ø 3 mm The indexed connection ensures reproducible

The indexed connection ensures reproducible positioning for the fabrication of the final prosthesis

It is particularly advantageous in cases requiring coordinated multi-component restorations with customizable top geometries

With its M1

MIS Seven®

Material: Burn-out plastic

BIONIKA DI UF, Temporary abutment, implant level, positioned Diameter:Ø 3 mm The indexed connection ensures reproducibleBrand characteristics The BIONIKA DI UF implant system is compatible with the DIO UF platform and features an advanced conical connection (Conical Connection) combined with a hexagonal fit, ensuring micromovement free load transfer and exceptional stability. The 22 cone angle directs forces deep into the implant body, reducing cortical bone stress and promoting long term osseointegration. The spirally micro grooved, self locking, and self compressing